ZEISS offers solutions to ensure a defect free printing performance of photomasks for 248 nm, 193 nm and EUV lithography. The systems precisely qualify photomasks according to the printing behavior. The first ZEISS AIMS machine was introduced in 1993. Today the systems are an integral part of the mask manufacturing process and guarantee the delivery of defect free masks to wafer fabs.
Down below you find the variety of the innovative AIMS® systems:
ZEISS AIMS 1x-193i is used for defect review, printability analysis and repair verification and qualifies photomasks with high precision and accuracy for todays and future technology nodes. AIMS® 1x-193i addresses the challenges of increased feature complexity, tighter mask specifications and more accurate and reliable defect disposition by offering an excellent CD repeatability and full illumination flexibility utilizing FlexIllu®, a computer controlled illumination and key enabler for SMO technology. The platform offers future performance upgrades to enhance the system capability with respect to CD repeatability and throughput to keep with ongoing technology demands. Furthermore, the AIMS® 193nm high-end platform supports additional applications such as AIMS® AutoAnalysis for fully automated and reliable analysis of aerial images and WLCD 2G for a printing aware CD metrology.
ZEISS AIMS fab neo provides the capability to perform defect and repair verification for 248 nm photomasks. Equipped with state-of-the-art technology the system is of choice when simplification and cost effectiveness are the main challenges. AIMS® fab neo offers a completely new design. The beam path is improved ensuring a high reliability and enhanced serviceability. The illumination unit is equipped with an exchangeable slider which allows a predefinition of up to 21 user definable sigma apertures. This ensures an easy switch of illumination schemes during operation.
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